Inline System
Rigid Inline System
Foldable Phone System
R-Hybrid Inline System
F-Hybrid Inline System
Hybrid Inline System
Organizing Equipment
LD / CLEANER / COG / FOG / AOI / CRD / TFOG / ULDEquipment Explanation
在RIGID PANEL绑定CHIP&FPC，检查在各个绑定部的对位及导电粒子压痕之后就涂补强胶，使用UV进行固化并在Touch Panel贴附TFPC的设备
BAEG HONG TAE010 5376 5512
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Organizing Equipment
LD / CLEANER / COP or COF / AOI / FOP or FOF / AOI / CRD+2D PRINT / ULDEquipment Explanation
- 是一款为生产Foldable Phone所需的专用设备，世界首创，本公司具有向三星垄断供货权。由作业者将PANEL Tray手动投入，TRAY供给到LD的话，自动供给ROBOT向COP移动并在柔性PANEL绑定CHIP，检查绑定区的对位及导电粒子,分布长度，绑定FPC,检查绑定区的对位及导电粒子，分布长度之后，涂补强胶并进行UV固化，读取PANEL二维码并将CODE打印在FPC上之后，用ULD移动并向PANEL自动供给ROBOT排除的设备BAEG HONG TAE010 5376 5512
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Organizing Equipment
LD / CLEANER / COG+COF / AOI / FOG+FOF / AOI + ART / CRD+2D PRINT / TFOG / ULDEquipment Explanation
在RIGID PANEL绑定IC(COF)&FPC，检查在各个绑定部的对位及导电粒子压痕之后就涂补强胶，使用UV进行固化并在Touch Panel贴附TFPC的设备
BAEG HONG TAE010 5376 5512
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Organizing Equipment
LD / CLEANER / COP+COF / AOI / FOP+FOF / AOI+ART / CRD + 2D PRINT / ULDEquipment Explanation
利用PANEL自动供给ROBOT 向LD供给PANEL的话，向COP+COF移送并在柔性PANEL绑定IC(COF)检查绑定区的对位及导电粒子,分布长度，绑定FPC,检查绑定区的对位及导电粒子，分布长度之后，涂补强胶并进行UV固化，读取PANEL二维码并将CODE打印在FPC上之后，用ULD移动并向PANEL自动供给ROBOT排除的设备BAEG HONG TAE010 5376 5512
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Organizing Equipment
LD / CLEANER / COG+COF+COP / AOI / FOG+FOF+FOP / AOI+ART+CRD+2D PRINT / ULDEquipment Explanation
RIGID HYBRID和FLEXIBLE HYBRID兼容的设备BAEG HONG TAE010 5376 5512
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